Blade SBI-611E-1C2N (Complete System Only)

  Products  SuperBlade   [ SBI-611E-1C2N ]









Integrated Board
B13SEE-CPU-25G


Views: | Angled View | Rear View | Front View |

| Angled Node View | Top Node View |





Key Applications
  - Enterprise data center
  - Cloud, CDN, AI/ML

 


Key Features

1. 70 servers per 42U rack
2. Single socket E (LGA-4677) supports 5th/4th Gen Intel® Xeon® Scalable processors
3. Intel® C741 chipset
4. 16 DDR5 DIMM slots, 2DPC with 5600MHz ECC RDIMM
5. 2 PCIe Gen5 slots; support 1 FHFL DW GPU or 2 SW PCIe cards
6. Support up to 5 drives per blade and SAS HW RAID
7. Dual-port 25G Ethernet (LOM), additional dual-port 25G Ethernet via mezzanine card
8. Front IO with 2 PCIe 5.0 slots for GPU and network cards
9. Liquid cooling solution is available*
* Please contact your Supermicro sales rep for more info.


 
Note: Complete system should include at least
1 CPU, 1 DIMM, & 1 HDD/SSD.

 Drivers & Utilities  BIOS / BMC  Manuals  Quick-References Guide  Download Driver CD

 Tested HDD  Tested NVMe  Tested M.2 List   Tested Memory  Tested AOC  OS Certification Matrix Compatible GPU List Blade Matrix

NOTE: Please email to support@supermicro.com for more information about upgrading to latest BIOS/BMC


 


Product SKUs
SuperBlade Sled
  • SBI-611E-1C2N
Motherboard
 
Processor
CPU
Note
  • Up to 300W TDP CPUs (Air Cooling at 35°C)
  • Certain CPUs with higher TDP may be supported under specific conditions. Please refer to Thermal Matrix.
GPU
Supported GPUs
  • NVIDIA PCIe: H100, L40S, L40, A100, A40, A10
  • AMD PCIe: Instinct MI100
CPU-GPU Interconnect
  • PCIe 5.0 x16 CPU-to-GPU Interconnect
GPU-GPU Interconnect
  • PCIe
 
System Memory
Memory Capacity
  • 16 DDR5 DIMM slots
  • 2DPC with 5600MHz ECC RDIMM
 
On-Board Devices
Chipset
  • Intel® C741 chipset
Network Controllers
  • Onboard Dual 25G Ethernet
  • 1 Mezzanine expansion slot for 2-port 25G Ethernet
MGMT/Security
  • IPMI 2.0 / KVM over IP / Redfish API/TPM 2.0/Signed Firmware/HW Root of Trust
Graphics
  • Aspeed AST2600
 
System BIOS
BIOS Type
  • 256Mb SPI Flash EEPROM with AMI® BIOS
BIOS Features
  • Plug and Play (PnP)
  • PCI 2.2
  • ACPI up to 3.0
  • USB Keyboard support
Dimensions
Height
  • 9.75"
Width
  • 1.75"
Depth
  • 23.5"
Weight
  • 12.1 lbs (5.49 kg)
Available Colors
  • Metalic Silver with Black Drive Bays
 
Front Panel
Buttons
  • Power On/Off button
LEDs
  • Power LED
  • UID
  • Network Activity LED
  • Fault LED
 
Expansion Slots (per Node)
PCIe
  • 1 PCIe Gen5 x16 slot, 1 PCIe Gen5 x8 slot, support 1 FHFL DW GPU or 2 SW PCIe cards
 
Drive Bays
Hot-swap
  • 2 Hot-swap U.2 NVMe/SAS/SATA; HW RAID with Broadcom 3108
M.2
  • 1 M.2 2280/22110 NVMe/SATA3 drive (onboard)
 
Input / Output
TPM
  • 1 TPM 2.0 Header
 
Operating Environment
RoHS
  • RoHS Compliant
Environmental Spec.
  • Operating Temperature:

       10°C ~ 35°C (50°F ~ 95°F)
  • Non-operating Temperature:

       -40°C to 60°C (-40°F to 140°F)
  • Operating Relative Humidity:

       8% to 90% (non-condensing)
  • Non-operating Relative Humidity:

       5% to 95% (non-condensing)


Optional Parts List
  Part Number Qty Description
TPM security module

(optional, not included)
AOM-TPM-9670V
AOM-TPM-9671V
- TPM module (Vertical) TPM 2.0
TPM module (Vertical) TPM 1.2.
VROC AOC-VROCPREMOD
AOC-VROCSTNMOD
- Intel VROC Premium, RAID 0, 1, 5, 10
Intel VROC HW key (RSTe) standard upgrade module
Heatsink / Retention SNK-P1046V - Heatsink for Rear CPU
CPU Carrier SKT-1333L-0000-FXC
SKT-1333L-0001-LTS
SKT-1424L-001B-FXC
SKT-1424L-001B-LTS
SKT-1425H-001C-FXC
SKT-1425H-001C-LTS
- Socket E LGA4677, E1A, XCC, DG 0.7
Socket E LGA4677, E1A, XCC, DG1.0, NO SHIM, BLK HSG
Socket E E1B LGA 4677 W/SHIM SP MCC, DG0.95
Socket E E1B LAG 4677 W/SHIM SPR MCC, DG1.0
Socket E E1C LGA 4677 W/O SHIM SPR+HBM, DG0.7
Socket E E1C LGA 4677 W/O SHIM SPR+HBM, DG0.7
Networking AOC-B25G-6X4D - Dual-port 25G Mezz card for SuperBlade 6U Chassis (Mellanox ConnectX-4 Lx EN)
Networking AOC-B25G-6CVL - 25G DUAL PORT MEZZANINE CARD,Intel Columbiaville, E810-XXVAM2
Software SFT-DCMS-Single - DataCenter Management Package (per node license)
Information in this document is subject to change without notice.

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