SuperServer SYS-222BT-HNC8R (Complete System Only)

2U 4-Node BigTwin with 6 hot-swap 2.5" NVMe/SAS/SATA drives per node

SYS-222BT-HNC8R Main SYS-222BT-HNC8R Angle SYS-222BT-HNC8R Node SYS-222BT-HNC8R Front SYS-222BT-HNC8R Rear
Integrated Board: X14DBT-B
Learn more

Key Applications

  • Container-as-a-Service; Application Accelerator
  • Diskless HPC Clusters
  • All-Flash Hyperconverged Infrastructure

Key Features

Four hot-pluggable systems (nodes) in a 2U form factor. Each node supports the following:

  1. Dual Socket E2 Intel® Xeon® 6 6700 series processors with E-cores up to 205W with air cooling or 330W with liquid cooling
    Single CPU configurations supported while maintaining all expansion slot functionality
  2. Up to 16 DIMMs supporting up to 4TB DDR5-6400 in 1DPC
  3. Flexible networking with OCP 3.0 AIOM slot
  4. Up to 2 PCIe 5.0 x16 LP slots
    Internal PCIe 5.0 for 2x NVMe M.2 support onboard
    Optional 4x NVMe M.2 support onboard with built-in HW RAID1 feature via SCC-A2NM2241GH-B1
  5. Up to 6 front hot-swap 2.5" NVMe/SAS drive bays
    Built-in SAS3 Support via Broadcom 3808; IT Mode
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SYS-222BT-HNC8R
Specifications Resources & Downloads Parts List
Specifications
Product SKUs
SuperServer SYS-222BT-HNC8R
Motherboard
Super X14DBT-B
Processor (per Node)
CPU
Core Count
  • Up to 144C/144T; Up to 108MB Cache per CPU
Note
  • Supports up to 205W TDP CPUs (Air Cooled)*
  • Supports up to 330W TDP CPUs (Liquid Cooled)​
  • *Air Cooled CPUs with TDP over 205W only supported under specific conditions. Contact a Supermicro representative for details.
System Memory (per Node)
Memory
  • Slot Count: 16 DIMM slots
  • Max Memory (1DPC): Up to 4TB 6400MT/s ECC DDR5 RDIMM
  • View Memory Options
On-Board Devices (per Node)
SAS
  • SAS (12Gbps) via Broadcom® 3808; (IT mode)
Chipset
  • System on Chip
Network Connectivity
Input / Output (per Node)
LAN
  • 1 RJ45 1 GbE Dedicated BMC LAN port
USB
  • 2 USB 3.0 Gen2 Type-A ports(Rear)
Video
  • 1 VGA port
System BIOS
BIOS Type
  • AMI 32MB Flash ROM
Management
Software
Power configurations
  • ACPI/APM Power Management
Security
Hardware
  • Trusted Platform Module (TPM) 2.0
  • Silicon Root of Trust (RoT) – NIST 800-193 Compliant
Features
  • Cryptographically Signed Firmware
  • Secure Boot
  • Secure Firmware Updates
  • Automatic Firmware Recovery
  • Supply Chain Security: Remote Attestation
  • Runtime BMC Protections
  • System Lockdown
PC Health Monitoring
FAN
  • Fans with tachometer monitoring
  • Status monitor for speed control
  • Pulse Width Modulated (PWM) fan connectors
Temperature
  • Monitoring for CPU and chassis environment
CPU
  • Monitors for CPU Cores, Chipset Voltages, Memory.
  • 8+4 Phase-switching voltage regulator
Chassis
Form Factor
  • 2U Rackmount
Model
  • CSE-217BQ2-R3K60P
Dimensions and Weight
Height
  • 3.47" (88 mm)
Width
  • 17.68" (449 mm)
Depth
  • 28.75" (730 mm)
Package
  • 9.76" (H) x 24.65" (W) x 45.28" (D)
Weight
  • Gross Weight: 96.6 lbs (43.8 kg)
  • Net Weight: 66.1 lbs (30 kg)
Available Color
  • Black front & silver body
Front Panel
LED
  • HDD activity LED
  • Network activity LEDs
  • Power status LED
  • Universal Information (UID) LED
Buttons
  • Power On/Off button
  • UID button
Expansion Slots (per Node)
PCI-Express (PCIe) Configuration
  • Default
    • 2 PCIe 5.0 x16 LP slots
    • 1 PCIe 5.0 x16 AIOM slot (OCP 3.0 compatible)
  • View AOC Options
Drive Bays / Storage (per Node)
Drive Bays Configuration
M.2
  • 2 M.2 PCIe 5.0 x4 NVMe slots (M-key 22110(default); VROC required for RAID)
System Cooling
Fans
  • 4x 16K RPM Counter Rotating 80x80x56mm Fan(s)
Liquid Cooling
  • Direct to Chip (D2C) Cold Plate (optional)
Power Supply
Operating Environment
ROHS
  • RoHS Compliant
Environmental Spec.
  • Operating Temperature: 10°C ~ 35°C (50°F ~ 95°F)
  • Non-operating Temperature: -30°C to 60°C (-22°F to 140°F)
  • Operating Relative Humidity: 8% to 80% (non-condensing)
  • Non-operating Relative Humidity: 8% to 90% (non-condensing)
Resources & Downloads
Parts List
Optional Parts List
Part Number Qty Description
2.5" Tool-less NVMe Tray MCP-220-00167-0B - Black gen 8 hot-swap 2.5" Tool-less NVMe tray, orange tab (Qty as Needed)
2.5" Tool-less SAS/SATA Tray MCP-220-00147-0B - Black gen 3 hot-swap 2.5" Tool-less HDD tray, red tab (Qty as Needed)
Cold Plate Module SNK-P3050-ABT 1 2x Supermicro Cold Plates for Attachment to CPUs (Qty per Node)
SNK-P3042 1 2x CoolIT Cold Plates for Attachment to CPUs (Qty per Node)
Coolant Distribution Manifolds SRK-00AS-CLIT-MF84SV-02 1 CoolIT 48U, 82S Dual Rack Coolant Manifolds (Qty per Rack)
SRK-00AS-CLIT-MF42SV-02 1 CoolIT 48U, 42S Single Rack Coolant Manifolds (Qty per Rack)
LCS-SCDM-076V42001-ABT 1 Supermicro Coolant Manifolds (Qty per Rack)
Coolant Distribution Unit SRK-00AS-CLIT-CH80V2-01 1 CoolIT 4U DLC CHx80V2 Coolant Distribution Unit (Qty per Rack)
LCS-SCDU-080L4001-ABT 1 Supermicro Rack Mounted Coolant Distribution Unit (Qty per Rack)
HDD Dummy Tray MCP-220-00185-0N - 2.5" HDD tray dummy cover for 2 slot (Qty as Needed)
M.2 NVMe RAID Controller SCC-A2NM2241GH-B1 1 2x Gen3 Marvell2241 NVMe M.2 RAID and 2x Gen5 Direct-from-CPU NVMe M.2 with 1x PCIEx16 Gen5. Supports 4x 22x110mm M.2 (Qty per Node)
SCC-A2NM2241G3-B1E 1 2x Gen3 Marvell2241 NVMe M.2 RAID with 1x PCIEx16 Gen5. Supports only 2x 22x110mm M.2 (Qty per Node)
SPI Capable TPM Options AOM-TPM-9670H-FIPS 1 SPI Capable TPM 2.0 Provisioned for Server, Horizontal Form Factor, Supporting FIPS 140-2 (Qty per Node)
AOM-TPM-9671H-S 1 SPI Capable TPM 1.2 Provisioned for Server, Horizontal Form Factor (Qty per Node)
AOM-TPM-9670H-S 1 SPI Capable TPM 2.0 Provisioned for Server, Horizontal Form Factor (Qty per Node)
SuperCloud Composer License SFT-SDDC-SINGLE - SDDC Monitor License - Single License per Monitored host
System Management Suite SFT-DCMS-Single - Supermicro System Management Software Suite node
VROC Options AOC-VROCPREMOD 1 Intel VROC Premium, RAID 0, 1, 5, 10 (Qty per Node)
AOC-VROCSTNMOD 1 Intel VROC Standard, RAID 0, 1, 10 (Qty per Node)

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