X11DSN-TSQ

X11DSN-TSQ
Intel® Quick Assist Technology
SIOM LAN Support
NVMe

Key Features


  1. 2nd Gen Intel® Xeon® Scalable Processors and Intel® Xeon® Scalable Processors,
    Dual Socket LGA-3647 (Socket P) supported, CPU TDP support Up to 205W TDP, 3 UPI up to 10.4 GT/s
  2. Intel® C627
  3. Up to 3TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 3TB 3DS ECC LRDIMM, DDR4-2933MHz, in 12 DIMM slots;
    Up to 2TB Intel® Optane™ DC Persistent Memory in memory mode (Cascade Lake only)
  4. 2 PCIe 3.0 x16 Left Riser Slot
    M.2 Interface: 1 PCIe 3.0 x4
    M.2 Form Factor: 2242/2260/2280
    M.2 Key: M-Key
  5. Dual LAN with 10GBase-T with Intel® X557
  6. 1 VGA D-Sub Connector port
  7. Intel® PCH SATA controller for
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Specifications Resources Parts List
Specifications
Product SKUs
MBD-X11DSN-TSQ
Physical Stats
Form Factor
  • Proprietary
Dimension
  • 11.5" x 13.9" (29.21cm x 35.31cm)
Processor
CPU
  • 2nd Gen Intel® Xeon® Scalable Processors and Intel® Xeon® Scalable Processors
  • Dual Socket Socket P (LGA-3647) supported, CPU TDP supports Up to 205W TDP, 3 UPI up to 10.4 GT/s
Note
  • BIOS version 3.2 or above is required to support 2nd Gen Intel® Xeon® Scalable processors (codenamed Cascade Lake-R)
System Memory
Memory Capacity
  • 12 DIMM slots
  • Up to 3TB 3DS ECC LRDIMM, DDR4-2933MT/s; Up to 3TB 3DS ECC RDIMM, DDR4-2933MT/s
  • Up to 2TB Intel® Optane™ DC Persistent Memory in memory mode (Cascade Lake only)
Memory Type
  • ECC DDR4 LRDIMM (3DS), RDIMM (3DS)
DIMM Sizes
  • LRDIMM: 64GB, 128GB
  • RDIMM: 64GB, 128GB
Memory Voltage
  • 1.2V
Error Detection
  • Corrects single-bit errors
  • Detects double-bit errors (using ECC memory)
On-Board Devices
Chipset
  • Intel® C627
SATA
  • Intel® PCH SATA controller for ports
IPMI
  • ASPEED AST2500
Graphics
  • 1 ASPEED AST2500 BMC port(s)
Network Controllers
  • Dual LAN with 10GBase-T with Intel® X557
Input / Output
USB
  • 1 USB 3.2 Gen1 port(s) (1 type A)
  • 2 USB 3.0 port(s) (2 rear)
Video Output
  • 1 VGA D-Sub Connector port(s)
Serial Port
  • 2 COM Port(s) (1 header; 1 rear)
TPM
  • 1 TPM Header
Expansion Slots
PCIe
  • 2 PCIe 3.0 x16 Left Riser Slot
M.2
  • M.2 Interface: 1 PCIe 3.0 x4
  • Form Factor: 2242/2260/2280
  • Key: M-Key
System BIOS
BIOS Type
  • AMI UEFI
Management
Software
  • SuperDoctor® 5, NMI, SUM, KVM with dedicated LAN, SPM, Intel® Node Manager, SSM, IPMI2.0, Watchdog, IPMI (Intelligent Platform Management Interface) v2.0 with KVM support, SuperDoctor® III
System Management Software
  • IPMI (Intelligent Platform Management Interface) v1.5 / 2.0 with KVM support
Power Configurations
  • M.2 NGFF connector, Node Manager Support, SDDC, System level control, UID, WOL
PC Health Monitoring
Voltage
  • VBAT, Monitors CPU voltages, 1.2V (VDIMM), 1.05 (PCH), +5V standby, +5V, +3.3V, +12V, +1.35V, Memory Voltages
LED
  • CPU / System Overheat LED
Temperature
  • Monitoring for CPU and chassis environment
FAN
  • 4x 4-pin fan headers (up to 4 fans)
  • PWM fan speed control
  • Overheat LED indication
Other Features
  • WOL, UID, RoHS, Node Manager Support, M.2 NGFF connector, Control of power-on for recovery from AC power loss, Chassis intrusion detection, RoHS, Halogen Free, Intel® QuickAssist Technology, Innovation Engine
Operating Environment
Operating Temperature Range
  • 10°C - 35°C (50°F - 95°F)
Non-Operating Temperature Range
  • -20°C - 60°C (-4°F - 140°F)
Operating Relative Humidity Range
  • 8% - 90% (non-condensing)
Non Operating Relative Humidity Range
  • 10% - 95% (non-condensing)
Resources
Component Options
Tested AOC List
Tested HDD / SSD List
Tested Memory List
Software
BMC Firmware
Download Driver CD
Download the Latest Drivers and Utilities
OS Compatibility
Update Your BIOS
Documentation
Motherboard Manual
Quick Reference Guide
Parts List

X11DSN-TSQ (For SuperServer Only)

  1. Products
  2. Motherboards
  3. X11DSN-TSQ

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