Key Features

1. 2nd Gen Intel® Xeon® Scalable Processors and Intel® Xeon® Scalable Processors, , Single Socket LGA-3647 (Socket P) supported, CPU TDP support Up to 165W TDP
2. Intel® C622 chipset
3. Up to 1.5TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 1.5TB 3DS ECC LRDIMM, DDR4-2933MHz, in 6 DIMM slots;
   Up to 1TB Intel Optane DC Persistent Memory in memory mode (Cascade Lake Only)
4. Expansion slots: 2 PCIe 3.0 x16, 1 PCIe 3.0 x8 (in x8)
5. M.2 NGFF connector
   M.2 Interface: PCIe 3.0 x4
   Form Factor: 2242, 2280
   Key: M-Key
6. 2 10G SFP+
7. 12 SATA3 (6Gbps) via C622
8. Supports 12V DC power input
9. 5 USB 3.0 (2 rear, 1 Type-A, 2 via header), 6 USB 2.0 (2 rear, 4 via headers)
10. I/O: 1 VGA, 2 COM, 1 TPM header